IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.
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This provides you with useful technical information for future designs, saving you time and money.
Solder Joint Reliability | NTS
Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, lpc and rigid-flex circuit structures.
Product Description Product Details Back. Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Thermal Cycling is the most common method of testing Solder Joint Reliability.
Training Media Permissible Uses. Representative temperature profile for thermal cycle test conditions.
Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute usually 10 to 14C 970 minute to avoid thermal shock with cycles per hour. See More See Less. The electrical resistance is continuously monitored during testing using data loggers.
Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints. Common test specifications include:. Per IPC, temperature extremes are based on the product category with the low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.
Common test specifications include: The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. When used with IPC-SM, it provides an understanding of the physics of SMT solder joint 97011 and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.